產品整合工程師崗位職責
集成灶產品項目工程師中山百得廚衛(wèi)中山百得廚衛(wèi)有限公司,中山百得廚衛(wèi),百得廚衛(wèi),百得廚衛(wèi)職責描述:
1、負責新產品預研的各類實驗和可行性論證,并提交報告;
2、負責產品的總裝和零部件三維圖、工程圖設計、繪制、修改,并確保其正確性、完整性和與實物的吻合性;
3、按照項目要求完成產品開發(fā)工作。
任職要求:
1、3年以上集成灶產品的開發(fā)工作經驗;
2、熟練使用pro/e或solidworks、autocad繪圖軟件。
篇2:底盤整合工程師崗位職責
底盤集成工程師法國賽科技術工程集團中國總公司賽科工業(yè)科技開發(fā)(武漢)有限公司,法國賽科技術工程集團中國總公司,賽科工業(yè),賽科Responsibilities:
?Chassiscomponents:
1)Collectthedata:architectureofchassis,componentsfiles(specification,drawings,testreports…)
2)Exchangewithpartner/partner’scomponentssuppliersinordertounderstandthedesignreferential,
3)SharethedatawithexpertsinChina&incentraloffice
4)ManagethedataandstoreitunderITsystem(tobedefined).
?FollowKP1developmentofchassisforinordertoprepareindustrializationoutsideChina:betheinterfacebetweenofficesandthepartnerforalltechnicallyrelatedtopics(intherespectofthejob-sharebetweenPandpartner).
?BusinesstripinSH,Dingzhou(Hebei),Chongqing
?Deliverablesregardingthelocalizationofchassiscomponents:
1)Architectureofchassissub-systems(chassisframe,brake,suspension,steering,axles,wheels,driveshafts):
2)Designmethodology/missionprofile/acceptancecriteria
3)Calculationreport
4)Validations:
a)Subcontractor(ifany)
b)Testprocedure
c)Testreports
5)BillOfMaterial
6)Foreachcomponent:
a)Drawings/Specifications(functionnalorbuilt-toprint)includingEssentialFunctionalCharacteristics
b)Supplier
c)Testprocedureandvalidationcriteria
d)Testreportsonbench(DV/PV)
e)Assemblyprocess/invariants
?DeliverablesregardingSafetyofESC(ISO26262),HPS,Brakecalipersandscrewingassemblies.
Inassistancetosafetynetworkexpert,collectandsupportDFMEA,DV/PV,Safetyrequirement,etc…
Requirement:
?Bachelororabove
?3-5years’workexperience
?FluentEnglish
?Goodmasterofthemechanicaldesign
?CurrentuseoftheChinese+English(speaking/writing/understanding)
?Knowledgeofthetechnicalofchassis:function,architecture+components(brake,suspension,steering,axles,wheels,driveshafts)
?Knowledgeofprojectdevelopmentforchassis
?Experienceintheenvironment.
篇3:半導體工藝整合工程師崗位職責
崗位職責:1.射頻半導體工藝持續(xù)改進:性能提升、良率提升;2.半導體工藝相關的失效分析及解決方案驗證。任職要求:1.深厚的半導體材料、器件、工藝背景知識。2.有CMOSSOI工藝或GaAsInPGaN工藝的開發(fā)工作經驗,熟悉半導體生產各道工藝的流程和運作機理。3.深刻理解FETHBTpHEMT等器件的工作機理,具有失效分析、器件性能改進和良率提升的能力。4.了解半導體工廠的運行流程,具有較強的向外溝通和組織能力。